打印页面
已停产
产品信息
制造商MICRON
制造商产品编号MT53E256M32D1KS-046 AAT:L
库存编号4263255
技术数据表
DRAM类型Mobile LPDDR4
存储密度8Gbit
记忆配置256M x 32位
时钟频率最大值2.133GHz
IC 外壳 / 封装VFBGA
针脚数200引脚
额定电源电压1.1V
芯片安装表面安装
工作温度最小值-40°C
工作温度最高值105°C
产品范围-
湿气敏感性等级MSL 3 - 168小时
产品概述
MT53E256M32D1KS-046 AAT:L is a mobile LPDDR4 SDRAM. The mobile low-power DDR4 SDRAM with low VDDQ (LPDDR4X) is a high-speed, CMOS dynamic random-access memory device. This device is internally configured with 1 channel ×16 I/O, having 8-banks. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 2133MHz clock rate, 4266Mb/s/pin data rate
- 1GB (8Gb) total density, 1.10V VDD2 / 0.60V VDDQ or 1.10V VDDQ operating voltage
- 256 Meg x 32 configuration, AEC-Q100 automotive grade
- 200-ball VFBGA 10 x 14.5 x 0.95mm (Ø0.40 SMD) package, -40°C to +105°C operating temperature
技术规格
DRAM类型
Mobile LPDDR4
记忆配置
256M x 32位
IC 外壳 / 封装
VFBGA
额定电源电压
1.1V
工作温度最小值
-40°C
产品范围
-
存储密度
8Gbit
时钟频率最大值
2.133GHz
针脚数
200引脚
芯片安装
表面安装
工作温度最高值
105°C
湿气敏感性等级
MSL 3 - 168小时
法律与环境
原产地:
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
进行最后一道重要生产流程所在的地区原产地:Taiwan
进行最后一道重要生产流程所在的地区
税则号:85423290
US ECCN:EAR99
EU ECCN:NLR
RoHS 合规:是
RoHS
RoHS 邻苯二甲酸盐合规:是
RoHS
下载产品合规证书
产品合规证书
重量(千克):.005443

