Print Page

MT62F2G32D4DS-026 WT:B

DRAM, Mobile LPDDR5, 64 Gbit, 2G x 32bit, 3.75 GHz, TFBGA, 315 Pins

MICRON
Image is for illustrative purposes only. Please refer to product description.
MICRON MT62F2G32D4DS-026 WT:B
ManufacturerMICRON
Manufacturer Part NoMT62F2G32D4DS-026 WT:B
Order Code4050916
Your Part Number
Technical Datasheet

Data Sheet

See all Technical Docs
118 In Stock

Need more?

118 Delivery in 5-6 Business Days(UK stock)
Available until stock is exhausted
QuantityPrice (inc GST)
1+CNY4,987.240 (CNY5,635.5812)
Price for:Each
Minimum: 1
Multiple: 1
CNY4,987.24 (CNY5,635.58 inc GST)
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
  • MICRON
    ManufacturerMICRON
    Manufacturer Part NoMT62F2G32D4DS-026 WT:B
    Order Code4050916
    Technical Datasheet

    Data Sheet

    DRAM TypeMobile LPDDR5
    Memory Density64Gbit
    Memory Configuration2G x 32bit
    Clock Frequency Max3.75GHz
    IC Case / PackageTFBGA
    No. of Pins315Pins
    Supply Voltage Nom1.05V
    IC MountingSurface Mount
    Operating Temperature Min-25°C
    Operating Temperature Max85°C
    Product Range-

  • MT62F2G32D4DS-026 WT:B is a mobile LPDDR5 SDRAM.

    • Architecture: 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
    • Frequency range: 1067–5MHz (data rate range per pin: 8533–40Mb/s with WCK:CK = 4:1)
    • Data interface: single x16 channel/die, double-data-rate command/address entry
    • Differential command clocks (CK-t/CK-c) for high-speed operation, differential data clocks
    • 16n-bit or 32n-bit prefetch architecture
    • Bank architecture: 8-bank (8B) mode, bank group (BG) mode, and 16-bank (16B) mode supported
    • Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
    • Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
    • 8GB (64Gb) total density, 7500Mb/s data rate per pin
    • 315-ball TFBGA package, -25°C ≤ Tc ≤ +85°C operating temperature
  • DRAM Type

    Mobile LPDDR5

    Memory Configuration

    2G x 32bit

    IC Case / Package

    TFBGA

    Supply Voltage Nom

    1.05V

    Operating Temperature Min

    -25°C

    Product Range

    -

    Memory Density

    64Gbit

    Clock Frequency Max

    3.75GHz

    No. of Pins

    315Pins

    IC Mounting

    Surface Mount

    Operating Temperature Max

    85°C

  • Country of Origin:
    Country in which last significant manufacturing process was carried outCountry of Origin:    Taiwan
    Country in which last significant manufacturing process was carried out
    Tariff No:85423239
    US ECCN:EAR99
    EU ECCN:NLR
    RoHS Compliant:Yes

    RoHS

    RoHS Phthalates Compliant:Yes

    RoHS

    Download Product Compliance Certificate

    Product Compliance Certificate

    Weight (kg):.000001