AS4C8M16SA-6BIN

DRAM, SDRAM, 128 Mbit, 8M x 16bit, 166 MHz, TFBGA, 54 Pins

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ALLIANCE MEMORY AS4C8M16SA-6BIN DRAM, SDRAM, 128 Mbit, 8M x 16bit, 166 MHz, TFBGA, 54 Pins
ManufacturerALLIANCE MEMORY
Manufacturer Part NoAS4C8M16SA-6BINCopy
Manufacturer Standard Lead Time18 weeks
Order Code4260940
Your Part Number
174 In Stock

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174 Delivery in 5-6 Business Days(UK stock)
QuantityPrice (inc GST)
1+CNY78.770 (CNY89.0101)
Price for:Each
Minimum: 1
Multiple: 1
CNY78.77 (CNY89.01 inc GST)
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.

Product Information

Product Overview

  • AS4C8M16SA-6BIN 128Mb SDRAM is a high-speed CMOS synchronous DRAM containing 128Mbits. It is internally configured as 4 Banks of 2M word x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a BankActivate command which is then followed by a read or write command. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either auto or self refresh are easy to use. By having a programmable mode register, the system can choose most suitable modes to maximize its performance. It is well suited for applications requiring high memory bandwidth and particularly well suited to high performance PC applications.

    • Fast access time from clock: 5/5.4ns, 2M word x 16-bit x 4-bank
    • Fully synchronous operation, internal pipelined architecture
    • Programmable mode registers, CAS latency: 2, or 3, burst length: 1, 2, 4, 8, or full page
    • Burst type: sequential or interleaved, burst stop function
    • Auto refresh and self refresh, 4096 refresh cycles/64ms
    • CKE power down mode, single +3.3V ± 0.3V power supply
    • LVTTL interface
    • 166MHz frequency
    • 54 ball TFBGA package
    • Industrial temperature range from -40 to 85°C

Technical Specifications

  • DRAM Type

    SDRAM

    Memory Configuration

    8M x 16bit

    IC Case / Package

    TFBGA

    Supply Voltage Nom

    3.3V

    Operating Temperature Min

    -40°C

    Product Range

    -

    SVHC

    No SVHC (04-Feb-2026)

    Memory Density

    128Mbit

    Clock Frequency Max

    166MHz

    No. of Pins

    54Pins

    IC Mounting

    Surface Mount

    Operating Temperature Max

    85°C

    MSL

    MSL 3 - 168 hours

Technical Docs 1

Legislation and Environmental

  • Country of Origin:
    Country in which last significant manufacturing process was carried outCountry of Origin:
    Taiwan
    Country in which last significant manufacturing process was carried out
    Tariff No:85423231
    US ECCN:EAR99
    EU ECCN:NLR
    RoHS Compliant:Yes

    RoHS

    RoHS Phthalates Compliant:Yes

    RoHS

    SVHC:No SVHC (04-Feb-2026)
    Download Product Compliance Certificate

    Product Compliance Certificate

    Weight (kg):.001083